Winonic’s Capabilities Matrix and Roadmap
| Capability / Construction | Standard Technology | Advanced Technology | R&D Current |
|---|---|---|---|
| Layer Count | 2-32 | 40 | > 42 |
| Overall Board Thickness (in.) | Min 0.025
Max 0.300 |
Min 0.012
|
Min 0.008
|
| Panel Size (in.) | Min 12x18
Max 21x24 |
Min 12x18
Max. 21x26 |
Min 9x12
Max 24x36 |
| Minimum Core Thickness (mils) | 2 | 2 | 1 |
| Trace / Space (mils) | 3/3 | 2/2 | <1/1 |
| Minimum Copper Cladding Weight | 3/8 oz | ||
| Maximum Copper Cladding Weight | 2 oz | 4 oz | 6 oz |
| HDI Layers | 2-3 | 4+ | 10+ |
| Lamination Cycles | 2-3 | 4 | 5+ |
| Layer Registration | .005" | .003" | .002" |
| Minimum Drill Size (Mechanical) | .0078" | .006" | .004" |
| Drill Aspect Ratio (PTH) | 10:1 | 16:1 | >20:1 |
| Drill Aspect Ratio (Filled Vias) | 8:1 | 12:1 | >12:1 |
| Microvia Aspect Ratio | .6:1 | .75:1 | 1:1 |
| Microvia Capture Pad to Hole Diameter | .006" | .004" | .003" |
| Backdrill Diameter above Prime Drill | .010" | .007" | <.007" |
| LDI Soldermask Minimum Web | .003" | .002" | .0015" |
| LDI Soldermask Minimum Clearance | .006" | .005" | .004" |
| Inkjet Legend Printing
White, Green, Red, Blue, Black |
Certifications
Certification Downloads:
- AS 9100D Certified
- ISO 9001:2015 Certified
- ITAR Registered
- IPC 6012 Class 3
- UL Certified
