Products

General Capabilities

• Fine Line Imaging - 50µm pitch (25µm Traces / 25µm Spaces)
• Microvias - 25µm - 100µm laser thru-vias
• Polyimide thickness – 12.5µm - 75µm
• Flex Base Material (Adhesive-less)
  • Sputtered Base Material (2µm-18µm Cu thickness – 12.5,25,50µm Polyimide)
  • Espanex (9,12,18,25,35µm Cu thickness – 12.5,25,50µm Polyimide)
  • Dupont AP, Kapton E,H (5,9,12,18,35µm Cu thickness – 25,50µm Polyimide)
  • Panasonic, Upilex, and other Asian materials
• Metal Layer Count - 1 to 4 layers
• Soldermask LPI Capability - 20µm - 75µm (Halogen free)
• Coverlay and Adhesive thicknesses – 12.5µm - 75µm
• UV and Co2 Laser capability
• Surface Plating
  • Electroless Cu
  • Electrolytic Cu
  • Electrolytic Nickel and Gold plating (Soft)
  • ENIG – Electroless Ni – Immersion Gold
  • HASL (Hot air solder leveling)
  • Immersion Tin
  • Immersion Silver
  • Organic Solderability Preservative
• Value Added Processing
  • Component Assembly – Lead free solder
  • Stiffeners and Reinforcement
  • RFI shielding and Grounding (noise reduction)
  • Partnered with local CM’s (contract manufacturing)

Services

Process Parameters

Drilling Mode

Thru and Blind via drilling of Copper and Polyimide material

Via Diameter

20µm - 200µm

Hole Position Accuracy

±25µm

Tooling Plate

Precision Vacuum plate w / Multi line pin system

Laser Types

UV Laser 355nm, diode-pumped, all solid-state
CO2 Laser, 9600nm, Sealed, RF-excited, super-pulsed